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Everest
Overview / Features Specifications
The Indilinx Everest SSD processor was designed to exceed the needs of the most demanding solid state storage solutions.
Overview

The Indilinx Everest SSD platform was designed to exceed the needs of the most demanding solid state storage solutions.  Combining a 275MHz dual-core CPU, 6Gbps SATA Version 3.0 interface, and support for the latest, most advanced NAND flash memory technology available, Everest offers SSD manufacturers unsurpassed flexibility in optimizing their designs for performance and cost. 

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Features

  • SATA Version 3.0 – Supports 6Gbps, 3Gbps, and 1.5Gbps interface speeds
  • 1TB maximum capacity
  • Wide compatibility with NAND flash memory - SLC and MLC; Asynchronous, ONFI2, and Toggle Mode
  • High reliability - Advanced BCH ECC engine can correct up to 70 bits per / Programmable sector
  • Efficient NAND flash management – Flash Translation Layer, dynamic and static wear-leveling, and background garbage collection
  • Performance consistency - No performance degradation between compressible and incompressible data
  • 400MHz DDR2/3 DRAM interface for user data cache and system metadata

 


Block Diagram

Everest SSD platform co-developed by Indilinx and Marvell

Specifications

    Applications
  • Workstations
  • Desktop PCs
  • Notebooks

      • Max Performance
  • Sequential Read 520MB/s
  • Sequential Write 410MB/s
  • 4K Random Read 30,000 IOPS
  • 4K Random Write 22,000 IOPS

      • Processor
  • Dual core CPU, up to 275MHz
  • 128KB program SRAM with zero wait states
  • 64KB Data SRAM with zero wait states

      • Host Interface
  • SATA 3.0 compliant; 6Gb/s, 3Gb/s, and 1.5Gb/s support
  • Native Command Queuing - Queue Depth of 32

      • Channels/Interleaving
  • 8 NAND channels, up to 16 way interleaving per channel

      • Max supported capacity
  • 8Up to 1TB

      • NAND flash support
  • ONFI 2 (up to Mode 5), Toggle Mode 1.0, and asynch ; supports 2x Geometry in MLC and SLC

      • DRAM Cache Support
  • Up to 512MB of 400Mhz DDR2/DDR3

      • Performance Optimization
  • TRIM (requires OS support)

      • Flash Management
  • Background garbage collection
  • Dynamic and static wear-leveling
  • Advanced flash defect management

      • Error Correction Code
  • BCH ECC corrects up to 70 bit per / Programmable sector

      • End-to-End Data Protection
  • Support for non-512B sectors, such as T10 DIF (Data Integrity Field)

      • Security
  • AES-256 Encryption
  • ATA Security Mode Features

      • Power Fail Protection
  • Optional Supercap protects against data loss after power failure

      • Power Management
  • Supports Host Initiated Power Management (HIPM)
  • Support Device Initiated Power Management (DIPM)

      • Power Consumption
  • Write: 1.4W; Read: 1.1W; Idle: 0.52W; Sleep: 35mW

      • Operating Temperature
  • 0°C ~ 70°C

      • Package
  • 400-Pin TFBGA – 17 x 17 x 0.88 mm

      • Compliance
  • RoHS

    • Solutions

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