Overview

Since its introduction in 2008, the Indilinx Barefoot SSD processor has set the industry standard for solid state drive performance, stability, and reliability. Barefoot offers SSD manufacturers unsurpassed flexibility in optimizing their designs for performance and cost. 
Features

  • SATA Revision 2.0 – Supports 3Gbps and 1.5Gbps interface speeds
  • 512GB maximum capacity
  • Wide compatibility with NAND flash memory – both SLC and MLC
  • High reliability - Advanced BCH ECC engine can correct up to 16 bits / 512B
  • Efficient NAND flash management – Flash Translation Layer, dynamic and static wear-leveling, and background garbage collection
  • Performance consistency - No performance degradation between compressible and incompressible data
  • Mobile SDRAM interface for user data cache and system metadata


Block Diagram

Specifications

    Applications
  • Workstations
  • Desktop PCs
  • Notebooks

    • Max Performance
  • Sequential Read 230MB/s
  • Sequential Write 230MB/s
  • 4K Random Read 10,000 IOPS
  • 4K Random Write 15,000 IOPS

    • Processor
  • ARM7 CPU
  • 128KB program SRAM with zero wait states
  • 64KB Data SRAM with zero wait states

    • Host Interface
  • SATA Revision 2.0 compliant; 3Gb/s support
  • Native Command Queuing - Queue Depth of 32

    • Channels/Interleaving
  • 4 16bit NAND channels, up to 8 way interleaving per channel

    • Max supported capacity
  • Up to 512GB

    • NAND flash support
  • MLC and SLC NAND

    • DRAM Cache Support
  • Up to 128MB of Mobile SDRAM

    • Performance Optimization
  • TRIM (requires OS support)

    • Flash Management
  • Background garbage collection
  • Dynamic and static wear-leveling
  • Advanced flash defect management

    • Error Correction Code
  • BCH ECC corrects up to 16bits/512B

    • Security
  • AES-256 Encryption
  • ATA Security Mode Features

    • Power Fail Protection
  • Optional Supercap protects against data loss after power failure

    • Power Management
  • Supports Host Initiated Power Management (HIPM)
  • Support Device Initiated Power Management (DIPM)

    • Operating Temperature
  • 0°C ~ 70°C

    • Package
  • 324-Pin FBGA – 14 x 14mm

    • Compliance
  • RoHS